Overview and status of bottom-up silicon nanowire electronics

This review summarises the recent advances in the field of silicon nanowire electronics from bottom-up assembled materials. The aim is to draw a comparison between bottom-up and top-down approaches, examining respective achievements and evaluating advantages and disadvantages of each methodology. Existing techniques for synthesis and doping are discussed to provide the framework in which practical electronic applications can be developed. Next, key device categories are reviewed, emphasising current challenges and proposed solutions. Finally, field perspectives are outlined.