Structural, optical and dielectric properties of HfSiO films prepared by co-evaporation method

HfSiO dielectric films were prepared on Si substrate by the co-evaporation method. The chemical composition, crystalline temperature, optical and electrical properties of the compound film were investigated. X-ray photoelectron spectroscopy analysis illustrated that the atom ratio of Hf to Si was about 4:1 and Hf–Si–O bonds appeared in the film. The X-ray diffraction analysis revealed that the crystalline temperature of the film was higher than 850 °C. Optical measurements showed that the refractive index was 1.82 at 550 nm wavelengths and the optical band gap was about 5.88 eV. Electrical measurements demonstrated that the dielectric constant and a fixed charge density were 18.1 and 1.95×1012 cm−2 respectively. In addition, an improved leakage current of 7.81 μA/cm2 at the gate bias of −3 V was achieved for the annealed HfSiO film.