| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 735802 | Optics and Lasers in Engineering | 2011 | 8 Pages |
Abstract
⺠A new hybrid process, which combined laser processing and wet etching, is proposed to IC molding removal. ⺠The relationship between processing condition and the processed surface quality is reported, and the removal processes are considered in each laser wavelength to select a suitable laser source. ⺠The new molding thickness-monitoring system is developed with the selected laser source. ⺠The hybrid process is carried out. The processing time and the volume of chemical solution used a process are compared with a conventional process.
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Authors
Tsuneo Kurita, Nagayoshi Kasashima, Hiroki Yamakiri, Nobuhito Ichihashi, Nobutoshi Kobayashi, Kiwamu Ashida, Shinya Sasaki,