| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 737595 | Sensors and Actuators A: Physical | 2012 | 5 Pages |
Abstract
TiNx thin films reactively magnetron sputtered on glass surface are examined for anodic bonding of glass plates for fully transparent device applications. Using under-stoichiometric titanium nitride thin films 22–63 nm thick to bond the glass substrates makes it possible to apply approximately 10 min preheating time, 3 min bonding time, bonding temperature of 430 °C and 50–120 V voltage to obtain the seals of about 13.5–27.0 MPa tensile strength.
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Piotr Mrozek,