Article ID Journal Published Year Pages File Type
737923 Sensors and Actuators A: Physical 2008 8 Pages PDF
Abstract

This work investigates the use of SU-8 microstructures for applications within flexible neural implants. Six different microstructures are fabricated and tested in both tension and bending to determine their Young’s modulus and their failure stress when deformed about a small radius of curvature. A numerical model is presented that accurately predicts the performance of the structures under bending, and physical testing shows that stresses of up to 300 MPa are achievable.

Related Topics
Physical Sciences and Engineering Chemistry Electrochemistry
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