Flip chip microassembly of a silicon triaxial force sensor on flexible substrates

Miniaturization of microelectromechanical systems (MEMS) based devices can be achieved by flip chip assembly directly onto a flexible circuit substrate. The main goal of this work was the selection of a suitable bonding material and process to enable scaling down of MEMS sensorized devices for biomedical applications. Finally, the heat bondable anisotropic conductive film 5552R (3M) allowed mechanical robust and low resistance electrical bondings together with a short process cycle time.