| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 738648 | Sensors and Actuators A: Physical | 2006 | 4 Pages |
Abstract
SU-8 photoresist shows superior images for thick film lithography and has been utilized as an electroplating mold. However, crosslinked SU-8 is difficult to remove reliably from high-aspect-ratio microstructures (HARMs) without damage or alteration to the electroplated metal. In this paper, an indirect SU-8 removal method is proposed. Instead of directly using SU-8 microstructure as the electroplating mold, a polydimethysiloxane (PDMS) replica is employed. The metallic micromold insert obtained through this method can be easily peeled off from the PDMS replica, meanwhile with high resolution and smooth surfaces.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Jianhua Li, Di Chen, Jinya Zhang, Jingquan Liu, Jun Zhu,