Article ID Journal Published Year Pages File Type
738749 Sensors and Actuators A: Physical 2008 7 Pages PDF
Abstract

For MEMS devices with power consumption in the range of micro-watts, thermal energy harvesting becomes a viable candidate for power supply. This paper describes a multipurpose platform to fabricate thermoelectric generators in a combined surface and bulk micromachining process. The thermocouples are deposited by thin-film processes with high integration density on the wafer surface. To provide a large thermal contact area, the heat flow path is perpendicular to the chip surface (cross-plane) and guided by thermal connectors. One thermocouple junction is thermally connected via electroplated metal stripes to the heat source and thermally insulated to the heat sink by a cavity in the wafer substrate. Simulations show that approximately 95% of the entire temperature difference over the device is located between the two thermocouple junctions. Power factors of 3.63 × 10−3 μW mm−2 K−2 and 8.14 × 10−3 μW mm−2 K−2 can be achieved with thermopiles made of Al and n-poly-Si or p-Bi0.5Sb1.5Te3 and n-Bi0.87Sb0.13, respectively. Measurements of fabricated devices show a linear output voltage of 76.08 μV K−1 per thermocouple and prove the feasibility of the concept.

Related Topics
Physical Sciences and Engineering Chemistry Electrochemistry
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