Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
747570 | Solid-State Electronics | 2006 | 7 Pages |
Abstract
A new semiempirical surface scattering model for electrons in strained Si devices including a quantum correction has been developed and implemented into our FBMC simulator. The strain is assumed to be consistent with pseudomorphic growth on a relaxed SiGe buffer. By introducing a few additional terms into the physical scattering rates which depend on the Ge-content in the SiGe buffer, the new surface scattering model can excellently reproduce low-field inversion layer mobility measurements for a wide range of Ge-content (0-30%) and substrate doping levels (1016-5.5Â ÃÂ 1018Â cmâ3). As a device example, an NMOSFET with 23Â nm gate length with and without a strained Si channel has been simulated by the new FBMC model.
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Authors
A.T. Pham, C.D. Nguyen, C. Jungemann, B. Meinerzhagen,