| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 747841 | Solid-State Electronics | 2015 | 8 Pages |
Abstract
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
Christine Harendt, Jan Kostelnik, Andreas Kugler, Enno Lorenz, Stefan Saller, Alina Schreivogel, Zili Yu, Joachim N. Burghartz,