Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
747950 | Solid-State Electronics | 2010 | 4 Pages |
Abstract
Low-resistivity Ni/Pt Ohmic contacts to p-type N-doped ZnO were fabricated in this paper. Ni/Pt Ohmic contacts showed a lowest specific contact resistivity of 3.81 × 10−6 Ω cm2 after 450 °C annealing, which is lower than any other reported Ohmic contacts to p-type ZnO. The interface reactions during annealing and the Ohmic contact formation mechanism were investigated by secondary ion mass spectrometry measurements. The results showed that Ni out-diffused to react with Pt and Zn out-diffused a little, too. These interface diffusions as well as activation of N acceptors during annealing induced such a low specific contact resistivity.
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Authors
Y.F. Lu, Z.Z. Ye, Y.J. Zeng, L.P. Zhu, J.Y. Huang, B.H. Zhao,