Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
748649 | Solid-State Electronics | 2010 | 4 Pages |
Abstract
Conventional InAs/AlSb HEMTs suffer from chemical instability in materials and high kink current. To avoid these drawbacks, this work proposes a novel layer structure of an InAsSb/AlSb HEMT and a novel two-step passivation process. Performance improvements are reduced dc output conductance by approximately 4.6 times at VDS = 0.5 V and ID = 100 mA/mm, and gate leakage to 1 × 10−3 mA/mm from 4 at VGS = −1.2 V and VDS = 0.8 V compared with those of two InAs/AlSb HEMTs, one with the conventional one-step and the other with the proposed two-step passivation process. Both dc and rf performances show strong evidences of impact ionization suppression.
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Authors
H.-K. Lin, Y.-C. Lin, F.-H. Huang, T.-W. Fan, P.-C. Chiu, J.-I. Chyi, C.-H. Ko, T.-M. Kuan, M.-K. Hsieh, W.-C. Lee, C.H. Wann,