| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 748658 | Solid-State Electronics | 2012 | 4 Pages |
The effects of Pt and Cu top electrodes on resistance switching properties were investigated for CuO thin films with Pt/CuO/Pt and Cu/CuO/Pt sandwich structures. Typical unipolar resistance switching (URS) behaviors and two different kinds of resistance changes in the reset process were observed in both structures. When voltages were applied to the film, the low-resistance state (LRS) with relatively low resistance value (<30 Ω) was switched to the high-resistance state (HRS), exhibiting normal reset behavior. For LRS with relatively high resistance value (>50 Ω), the resistance first decreased then increased to HRS, showing abnormal reset behavior. The former variation of LRS could be ascribed to the decrease in filament size induced by Joule heating, while the latter one could be ascribed to the growth of disconnected filaments induced by high electric fields. This study indicates that the switching modes and the abnormal reset behaviors in CuO thin films are not due to Pt and Cu top electrodes, but the intrinsic properties of CuO film.
► We study effects of Pt and Cu electrodes on resistance switching in CuO thin films. ► Pt/CuO/Pt and Cu/CuO/Pt structures both show unipolar resistance switching. ► Pt/CuO/Pt and Cu/CuO/Pt structures both show abnormal reset behaviors. ► Resistance switching in CuO thin films is not dependent on top electrodes.
