Article ID Journal Published Year Pages File Type
749013 Solid-State Electronics 2008 6 Pages PDF
Abstract

The physical concepts developed to describe the transient activation of boron during post-implantation annealing are based on the concurrent formation of complexes comprising boron atoms and self-interstitials. A complete implementation into TCAD software leads to a high number of equations to be solved which is often inadmissible for multi-dimensional simulations. In this work, a minimum number of such complexes is taken into considerations. We show that such a model is nevertheless able to reproduce profile shape and dopant activation for a large variety of implant and annealing conditions.

Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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