Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
749013 | Solid-State Electronics | 2008 | 6 Pages |
Abstract
The physical concepts developed to describe the transient activation of boron during post-implantation annealing are based on the concurrent formation of complexes comprising boron atoms and self-interstitials. A complete implementation into TCAD software leads to a high number of equations to be solved which is often inadmissible for multi-dimensional simulations. In this work, a minimum number of such complexes is taken into considerations. We show that such a model is nevertheless able to reproduce profile shape and dopant activation for a large variety of implant and annealing conditions.
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Authors
J. Schermer, A. Martinez-Limia, P. Pichler, C. Zechner, W. Lerch, S. Paul,