Article ID Journal Published Year Pages File Type
749076 Sensors and Actuators A: Physical 2012 6 Pages PDF
Abstract

This paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This structure consists of two dielectric substrates and benzocyclobutene (BCB) sealing rings at the wafer level. The wafer level packaging that holds the radiating patch is made of Pyrex, a low permittivity substrate. The millimeter-wave antenna using the micromachining technology is excited by a coplanar waveguide fed aperture (CPWFA). This feeding mechanism is designed and realized on GaAs, a high permittivity substrate. The electromagnetic energy of the CPWFA to the radiating patch is made through a coupling slot. The fabricated antenna of 6 mm × 6 mm, including the ground plane, exhibits a 10 dB bandwidth of 3 GHz from 50.5 GHz to 53.5 GHz. The design has been driven by the interest of collective encapsulation of MEMS and MMICs devices.

Related Topics
Physical Sciences and Engineering Chemistry Electrochemistry
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