Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
749285 | Solid-State Electronics | 2008 | 4 Pages |
Abstract
Low-temperature (<500 °C) solid-phase crystallization (SPC) of amorphous Si1−xGex (x: 0–0.7) films was examined on insulating substrates by using Ni-imprint technique. Incubation time for SPC was remarkably reduced by catalytic effects without changing growth velocity. As a result, Ni-free large SiGe grains (∼4 μm) were obtained at controlled positions. The crystallinity of the grown regions was almost the same as that of poly-SiGe formed by the conventional high temperature SPC at 600 °C.
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Engineering
Electrical and Electronic Engineering
Authors
Kaoru Toko, Hiroshi Kanno, Atsushi Kenjo, Taizoh Sadoh, Tanemasa Asano, Masanobu Miyao,