Article ID Journal Published Year Pages File Type
749285 Solid-State Electronics 2008 4 Pages PDF
Abstract

Low-temperature (<500 °C) solid-phase crystallization (SPC) of amorphous Si1−xGex (x: 0–0.7) films was examined on insulating substrates by using Ni-imprint technique. Incubation time for SPC was remarkably reduced by catalytic effects without changing growth velocity. As a result, Ni-free large SiGe grains (∼4 μm) were obtained at controlled positions. The crystallinity of the grown regions was almost the same as that of poly-SiGe formed by the conventional high temperature SPC at 600 °C.

Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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