Article ID Journal Published Year Pages File Type
749814 Solid-State Electronics 2006 4 Pages PDF
Abstract

Self-assembled cobalt (Co) nanocrystals on ultra-thin silicon dioxide layer were fabricated by in situ annealing Co ultrathin films deposited with Co effusion cell in a molecular-beam-epitaxy chamber. The resultant nanocrystals obtained at the optimized annealing temperature are around 3–4 nm in diameter with dot density of about 1 × 1012 cm−2. The metal–oxide–semiconductor capacitors containing Co nanocrystals exhibit much longer retention times than a Si nanocrystal memory with the same tunneling oxide thickness. This study suggests that Co nanocrystal should be an excellent alternative to replace Si nanocrystal as floating gates for future nonvolatile flash-type memory application.

Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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