| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 752456 | Acta Mechanica Solida Sinica | 2013 | 14 Pages |
Abstract
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review of several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
