Article ID Journal Published Year Pages File Type
755539 Chinese Journal of Aeronautics 2009 4 Pages PDF
Abstract

This article uses a 2/4 functional epoxy blend system (E-54/AG-80) cured with diaminodiphenyl sulphone(DDS) as a raw material and develops a methodological procedure to establish a cure kinetic model with isothermal and dynamic differential scanning calorimeter(DSC) method and a gelation model with round-disk compression mode dynamic mechanical analyzer(DMA), thus acquiring a series of experimental data. Characteristic temperatures such as initial glass transition temperature Tg0, gelation glass transition temperature gelTg, and infinite glass transition temperature Tg∞ are determined. The cure degree at gelation is turned out to be 0.45, while gelTg is found to be 70.2 °C. The data are then used to form time-temperature-transition(TTT) diagram of the system, which serves to be a tool for process optimization of epoxy-matrix composites. A new cure processing is therefore derived from the TTT diagram. The final phase structure obtained from a controllable method is identified through scanning electron microscope(SEM) photographs to be of ‘ex-situ’ phase morphology.

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Physical Sciences and Engineering Engineering Aerospace Engineering