| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 756820 | Computers & Fluids | 2011 | 7 Pages |
Abstract
An improved low diffusion E-CUSP (LDE) scheme is presented. The E-CUSP scheme can capture crisp shock profile and exact contact surface. Several numerical cases are presented to demonstrate the accuracy and robustness of the new scheme.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Ge-Cheng Zha, Yiqing Shen, Baoyuan Wang,