Weakening of the anisotropy of surface roughness in ultra-precision turning of single-crystal silicon

Ultra-precision machining causes materials to undergo a greatly strained deformation process in a short period of time. The effect of shear strain rates on machining quality, in particular on surface anisotropy, is a topic deserving of research that has thus far been overlooked. This study analyzes the impact of the strain rate during the ultra-precision turning of single-crystal silicon on the anisotropy of surface roughness. Focusing on the establishment of cutting models considering the tool rake angle and the edge radius, this is the first research that takes into account the strain rate dislocation emission criteria in studying the effects of the edge radius, the cutting speed, and the cutting thickness on the plastic deformation of single-crystal silicon. The results of this study show that the uses of a smaller edge radius, faster cutting speeds, and a reduced cutting thickness can result in optimally uniform surface roughness, while the use of a very sharp cutting tool is essential when operating with smaller cutting thicknesses. A further finding is that insufficient plastic deformation is the major cause of increased surface roughness in the ultra-precision turning of brittle materials. On this basis, we propose that the capacity of single-crystal silicon to emit dislocations be improved as much as possible before brittle fracture occurs, thereby promoting plastic deformation and minimizing the anisotropy of surface roughness in the machined workpiece.