On a moving dielectric crack in a piezoelectric interface with spatially varying properties

This paper provides a comprehensive theoretical analysis of a finite crack propagating with constant speed along an interface between two dissimilar piezoelectric media under inplane electromechanical loading. The interface is modeled as a graded piezoelectric layer with spatially varying properties (functionally graded piezoelectric materials, i.e., FGPMs). The analytical formulations are developed using Fourier transforms and the resulting singular integral equations are solved with Chebyshev polynomials. Using a dielectric crack model with deformation-dependent electric boundary condition, the dynamic stress intensity factors, electric displacement intensity factor, crack opening displacement (COD) intensity factor, and energy release rate are derived to fully understand this inherent mixed mode dynamic fracture problem. Numerical simulations are made to show the effects of the material mismatch, the thickness of the interfacial layer, the crack position, and the crack speed upon the dynamic fracture behavior. A critical state for the electromechanical loading applied to the medium is identified, which determines whether the traditional impermeable (or permeable) crack model serves as the upper or lower bound for the dielectric model considering the effect of dielectric medium crack filling.