| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 768257 | Engineering Fracture Mechanics | 2006 | 22 Pages |
Abstract
The analysis of cracking and delamination of a plate bonded to a substrate is presented in the paper. The plate is subjected to a monotonic temperature loading. Several types of interface constitutive laws are used in order to obtain analytical solutions specifying the maximum number of plate fragments and the description of fragmentation process. The segmentation cracking model is further used to measure the ultimate shear strength of a thin film-substrate interface.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Marcin BiaÅas, Zenon Mróz,