Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7702386 | Ultrasonics Sonochemistry | 2018 | 22 Pages |
Abstract
To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22â¯Î¼m at 285â¯Â°C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17â¯Î¼m Mg2Sn layer without crack was obtained at a temperature of 200â¯Â°C, ultrasonic power of Mode I, and ultrasonic time of 2â¯s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed.
Related Topics
Physical Sciences and Engineering
Chemistry
Chemistry (General)
Authors
Zhiwu Xu, Zhengwei Li, Jiaqi Li, Zhipeng Ma, Jiuchun Yan,