Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7703305 | Ultrasonics Sonochemistry | 2018 | 33 Pages |
Abstract
In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1â¯Â±â¯0.05â¯MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175â¯Âµm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150â¯Âµm and 200â¯Âµm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.
Related Topics
Physical Sciences and Engineering
Chemistry
Chemistry (General)
Authors
Thomas D.A. Jones, Anne Bernassau, David Flynn, Dennis Price, Matthew Beadel, Marc P.Y. Desmulliez,