| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 770849 | Engineering Fracture Mechanics | 2010 | 12 Pages |
Abstract
The growth behavior of cracks is monitored on specimens of ultrafine grained copper produced by equal channel angular pressing. Temporary retardation of crack growth under low stress amplitudes occurs when the crack length reaches about 0.1 mm, but there is no similar retardation at high stress amplitudes. Dependent on stress amplitude, different crack growth path morphologies develop. Analysis of the fracture surfaces is conducted by scanning electron microscopy, showing planer, granular and striated surfaces. The physical background of growth path and fracture surface formation is discussed by considering crack growth mechanism and microstructural inhomogeneity.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
M. Goto, Y. Ando, S.Z. Han, S.S. Kim, N. Kawagoishi, K. Euh,