| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 771308 | Engineering Fracture Mechanics | 2008 | 9 Pages |
Abstract
In this article, the crack growth driving force and the resistance to cleavage cracking associated with crack front transmission across a high-angle grain boundary in a silicon thin film are analyzed, and a closed-form solution of grain boundary toughness is obtained. It is noticed that the fracture resistance of the grain boundary is a function of the film thickness. This size effect is attributed to the nonuniform nature of cleavage front advance.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Yu Qiao, Jin Chen, Xinguo Kong, Srinivas S. Chakravarthula,