Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
772131 | Engineering Fracture Mechanics | 2007 | 8 Pages |
Abstract
In the current paper crack redirection due to a strategic placing of a heat source in the vicinity of a crack tip is studied. Analysis suggests that for PMMA and considered temperature range the only factor responsible for the deviation of crack trajectory is thermal stress. The simulation of crack growth in PMMA under external tension and secondary heat loading shows that a moving heat source in the vicinity of a crack tip can serve as a pointer for the crack trajectory. In highly conductive materials, redirection can be possibly effected with low-power thermal dipoles.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Anastasia Dobroskok, Larissa Fradkin, Alexander Linkov, Gennady Mishuris,