Three-dimensional singular stress field near the interfacial bond line of a tapered jointed plate either free-standing (notch) or (fully/partially) attached to a super-rigid inclusion (antinotch)

A three-dimensional eigenfunction expansion approach is employed for determining singular stress fields in the vicinity of interfacial bond line of a tapered jointed plate either free-standing (notch) or (fully/partially) attached to a super-rigid inclusion (antinotch). The tapered jointed bi-material plate is subjected to extension/bending (mode I) and shear/twisting (mode II) far field loading (extension and shear being in the plane of the cross-section and bending/twisting about mid-width). Hitherto unavailable results, pertaining to the width-wise variations of stress intensity factors corresponding to symmetric and skew-symmetric (about mid-width) cosine function loads, in the vicinity of the interfacial bond line, are presented.

► Dependence of stress singularity on wedge aperture angle for notches and antinotches. ► A tapered-jointed plate is extremely sensitive to delamination flaw. ► Antinotch stress singularity behaves opposite to its notch counterpart. ► Through-width variations of normalized stress intensity factors presented. ► Discontinuity in stress intensity factor at mid-width in the skew-symmetric case.