Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
776618 | International Journal of Adhesion and Adhesives | 2008 | 4 Pages |
Abstract
In this paper, silver plating graphite powders were developed by electroless plating method. The density of silver plating graphite powders was 2.61 g/cm3 and the ratio of silver for the powders was 25 wt%. After being mixed with epoxy resin and curing agent, silver plating graphite powders conductive adhesive was obtained, with the percolation concentration of 28 vol%. Compared to pure Ag conductive adhesive, the new conductive adhesive has the advantage of low cost. Adhesives based on the graphite or Ag plating graphite powders exhibited higher tensile strength and larger failure elongations than pure Ag conductive adhesive.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Liang Tongxiang, Guo Wenli, Yan Yinghui, Tang Chunhe,