Article ID Journal Published Year Pages File Type
776790 International Journal of Adhesion and Adhesives 2006 7 Pages PDF
Abstract

The effect of adhesive thickness and its modulus on the performance of adhesively bonded piezoelectric elements for the purpose of monitoring structural health has been experimentally investigated. All the piezoelectric elements were adhesively bonded to aluminum plates. Experimental results revealed that an increase in adhesive thickness alters the electromechanical impedance and the resonant frequency of the piezoelectric elements as well as the amplitude of the sensor signal. When the modulus is within a certain range, the modulus of adhesive slightly affects the impedance of PZT element and the amplitude of sensor signal at lower frequency, while at high frequency, the impedance response and sensor signal are more sensitive to the modulus of adhesive.

Related Topics
Physical Sciences and Engineering Engineering Mechanical Engineering
Authors
, , , , ,