Article ID Journal Published Year Pages File Type
777500 International Journal of Adhesion and Adhesives 2007 9 Pages PDF
Abstract

The effect of the length and depth of a parallel slot as well as the elastic modulus of the adhesive on the stress distribution at the mid-bondline and in the adherend was investigated using the elastic finite element method. The results showed that the peak stress in mid-bondline decreased markedly when there were two of parallel slots located in the outside of the adherend, corresponding to the middle part of the lap zone and the original low stress in this zone of the joint increases. The peak stress decreased at first, and then increased again as the length of the parallel slot was increased. The stress distribution in the mid-bondline at the position corresponding to the parallel slot decreased significantly as the depth of the parallel slot was increased. The high peak stresses caused by the tensile load occurred close to the edge of the parallel slot in the adherend. Almost all the peak values of stresses at the mid-bondline increased when the elastic modulus of the adhesive was increased. The effect of the parallel slot on the peak stress at the mid-bondline with a low elastic modulus adhesive was negligible, but the peak stress decreased markedly for adhesives with a high elastic modulus.

Related Topics
Physical Sciences and Engineering Engineering Mechanical Engineering
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