Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
780110 | International Journal of Adhesion and Adhesives | 2008 | 11 Pages |
Abstract
The mechanical behavior and failure mechanisms of non-conductive adhesive (NCA) joints exposed to accelerated testing environments have been investigated. The study reveals that moisture preconditioning induces a rapid and drastic decrease in the mechanical strength and modulus of NCA joints. Recovery experiments indicate that the loss in modulus was reversible upon re-drying, but nonetheless more irreversible damage did occur at NCA joints due to hydrolysis. A hydrolytic degradation mechanism at the NCA/polyimide interface is proposed.
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Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
W.K. Chiang, Y.C. Chan, Brian Ralph, Andew Holland,