Article ID Journal Published Year Pages File Type
780185 International Journal of Adhesion and Adhesives 2006 8 Pages PDF
Abstract
It is widely demonstrated in literature that the presence and the density of adhesive bonding defects are difficult to estimate with conventional non-destructive testing techniques once the parts are assembled together. For this reason it is very important to set up a new methodology capable of estimating the adhesive bonding defect and the final releasing moment of the assembled joints. The purpose of this paper is to verify the performance of the acoustic emissions technique when applied, as a non destructive one, in this field. Our investigation aimed to highlight the good correlation between the density of the adhesive defect (low, medium and high) and the cumulative counts of the acoustic emissions and to verify the accuracy of the estimated final releasing moment of the coupling.
Related Topics
Physical Sciences and Engineering Engineering Mechanical Engineering
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