Micro-dimple pattern process and orthogonal cutting force analysis of elliptical vibration texturing

•A texturing process of EVT method is described to introduce the knowledge of texturing process.•A mathematical model and experimental results were compared for validation of the mathematical model of the EVT.•Orthogonal cutting force analysis was used to analyze the cutting force during the EVT process.•The transient cutting force values depend on the transient cutting area during the EVT process.•Simulated and experimental cutting force results were compared for validation of the EVT cutting force model.•The deformed chips were analyzed for determining the actual shear angle value based on chip dimension ratio.

Elliptical vibration cutting (EVC) has been studied extensively due to its superior performance. Benefits include reduced cutting force, tool wear, burrs, and surface roughness. This paper demonstrates the fabrication of a micro-dimple pattern using elliptical vibration texturing (EVT) based on the EVC method. An analytical model of the texturing process and an orthogonal cutting force analysis are presented. The micro-dimples were successfully established on Al-6061 using different vibration frequencies. The accuracy of the micro-dimples was measured and compared to an analytical model in order to validate the texturing process. The orthogonal cutting force model was used to simplify the cutting mechanism analysis. The effect of transient shear angle is not considered in the texturing process due to the small slope angle of the tool path. The result shows that the analytical model of the cutting force corresponds well with the experimental data.