Article ID Journal Published Year Pages File Type
784494 International Journal of Machine Tools and Manufacture 2011 7 Pages PDF
Abstract

An ultrafine diamond wheel of a mesh size of 12,000 was fabricated by using a hybrid bond material, which consists of silicon carbide, silica and alumina. The employment of the newly developed wheel enabled excellent performance during grinding of silicon wafers. An extremely smooth surface of an average roughness of 0.6 nm was achieved. TEM examinations showed that the total thickness of the defected layer was less than 60 nm.

Related Topics
Physical Sciences and Engineering Engineering Industrial and Manufacturing Engineering
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