Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7877670 | Acta Materialia | 2016 | 12 Pages |
Abstract
The very initial stages of interfacial interactions between Cu and liquid Sn-0.7 wt%Cu alloy for dipping time t between about 50 and 65 ms are studied for the first time by ultra rapid dipping. For t < 65 ms, only the η-Cu6Sn5 phase is observed at the interface, the ε-Cu3Sn phase being absent at TEM scale. For t â¼Â 1 s the classical Cu/ε-Cu3Sn/η-Cu6Sn5/liquid alloy configuration is found at the interface. A schematic illustration of phase growth at Cu/liquid Sn interface, based on these experimental results, is proposed.183
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
O.Y. Liashenko, S. Lay, F. Hodaj,