Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7881529 | Acta Materialia | 2014 | 11 Pages |
Abstract
The utility of silicon carbide (SiC) as an engineering material is often limited by its brittleness. This work attempts to better illuminate the key mechanisms associated with this property by studying crack tip behavior. A multipronged investigative approach is taken, utilizing direct molecular dynamics simulations with empirical potentials, analytic modeling and electronic structure calculations. This approach enables us (i) to make atomistic-based predictions of the key mechanisms that occur at a SiC crack tip across a wide range of temperatures and strain rates; and (ii) to better understand the strengths and deficiencies of these analysis tools for predicting fracture in covalently bonded materials.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
K.W.K. Leung, Z.L. Pan, D.H. Warner,