Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7881691 | Acta Materialia | 2014 | 9 Pages |
Abstract
Grain boundary stress relaxation in Au polycrystals and single crystals has been studied by mechanical spectroscopy. A relaxation peak related to grain boundaries is observed at 620 K. Molecular dynamics simulations on Au are performed in order to illustrate the potential microscopic mechanisms responsible for the stress relaxation peak in Au polycrystals. A Σ5 grain boundary is submitted to a shear deformation parallel to the boundary plane. In agreement with previous studies on Cu, the grain boundary shows a migration perpendicular to the boundary plane coupled to shear for temperatures below 700 K. Above 1000 K, only grain boundary sliding occurs. Two models are developed that provide expressions for the relaxation strength Î and the relaxation time Ï that are compared to experimental measurements performed on polycrystals. The observed grain size dependence of Î and Ï favours the sliding model over the migration model.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Ann-Kathrin Maier, Daniele Mari, Iva Tkalcec, Robert Schaller,