Simulating tape resin infiltration during thermoset pultrusion process

This paper models the resin infiltration process during pultrusion, by modifying the pre-existing simulation tool for liquid molding processes. The formulated capability can be used not only to optimize the impregnation dynamics within the pressure chamber, but can also be used to predict the required forces for the selected pulling rate. The proposed model does allow one to handle a variety of tape cross-sections, not just rectangular prisms.