| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7894642 | Corrosion Science | 2016 | 11 Pages |
Abstract
Sn whiskers are spontaneously grown out of the oxide layers and the intermetallic compounds of Sn-based solder alloy, and then the frequent occurrence of Sn whiskers causes a short circuit or trip in the electronic components. With regard to the improvement of the oxidation resistance, Ag2S chalcogenide compounds inhibit the formation of intermetallic compounds and thus interrupt the growth of Sn whiskers at the same time.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Sang Hoon Kim, Kwun Nam Hui, Yong-Jin Kim, Tae-Soo Lim, Dong-Yeol Yang, Ki Bong Kim, Young Ja Kim, Sangsun Yang,