Nanoscale corrosion behavior of polycrystalline copper fine wires in dilute NaCl solution investigated by in-situ atomic force microscopy

In this study, nanoscale corrosion behavior of copper fine wires in dilute NaCl solution is studied by atomic force microscopy and electron backscatter diffraction. The dissolution rate of grains constituting the wires strongly depends on their crystallographic orientation. In pure water, the dissolution rate increases in the order of (111) < (001) < (110). Addition of Cl− dramatically increases the dissolution rate of the (111) surface to alter the order to (110) ≈ (001) ≈ (111) at 0.1 mM. These results show that the crystallographic orientation dependence is significantly changed by a slight increase of Cl− concentration in dilute solution.