Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7895861 | Corrosion Science | 2014 | 12 Pages |
Abstract
The tarnishing of the Au-Ag-(Pd)-Cu-Si bulk metallic glass system is studied based on the Yellowness Index detection and on microstructural investigations during various and prolonged low-temperature exposures. Polished surfaces tarnish faster than as-cast surfaces due to the removal of the native SiO2 film. The rate decreases with decreasing nominal Cu/Si and Si/Au ratios, with removing Pd, and with microalloying of Al. The tarnishing mechanism is controlled by the internal oxidation of the glassy matrix forming amorphous SiO2 dendrites. This triggers the partitioning of metallic elements that enhances the rate of out-diffusion and surface oxidation of Cu.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Miriam Eisenbart, Ulrich E. Klotz, Ralf Busch, Isabella Gallino,