| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7898469 | Journal of the European Ceramic Society | 2018 | 37 Pages |
Abstract
In this paper, Ti3Si(Al)C2 was introduced into dense SiC/SiC to improve the mechanical and electromagnetic interference (EMI) shielding properties. In order to reveal the effect of Ti3Si(Al)C2, dense SiC/SiC-Ti3Si(Al)C2 and dense SiC/SiC without Ti3Si(Al)C2 were fabricated. Owing to the plastic deformation toughening mechanism of Ti3Si(Al)C2, SiC/SiC-Ti3Si(Al)C2 performs a new damage mode characterized by matrix/matrix (m/m) debonding. High interfacial shear strength (IFSS) due to large thermal residual stress (TRS) is weakened by m/m debonding. This new mode also brings high effective volume fraction of loading fibers and long path of crack propagation. Hence SiC/SiC-Ti3Si(Al)C2 exhibits higher flexural strength (503 MPa) and fracture toughness (23.7 MPa · m1/2) than the dense SiC/SiC without Ti3Si(Al)C2. In addition, dense SiC/SiC-Ti3Si(Al)C2 shows excellent electromagnetic interference shielding effectiveness (EMI SE, 43.0 dB) in X-band, revealing great potential as thermo-structural and functional material.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Xiaokang Ma, Xiaowei Yin, Xiaomeng Fan, Xinnan Sun, Lingwei Yang, Fang Ye, Laifei Cheng,