| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7908618 | Optical Materials | 2016 | 6 Pages |
Abstract
The analysis of thermal effects in a diffusion bonded Er3+,Yb3+:glass/Co2+:MgAl2O4 microchip laser is presented. The analysis is performed for both wavelengths at 940Â nm and at 975Â nm as well as for two different sides of pumping, glass side and saturable absorber side. The heat sink effect of Co2+:MgAl2O4, as well as the impact of the thermal expansion and induced stress on the diffusion bonding are emphasised. The best configurations for reducing the temperature peaks, the Von Mises stresses on the diffusion bonding, and the thermal lensing are determined.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Nabil Belghachem, Jaroslaw Mlynczak, krzysztof Kopczynski, Zygmunt Mierczyk, Michal Gawron,