| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7911176 | Scripta Materialia | 2018 | 5 Pages |
Abstract
Nanostructures and Cu atoms are introduced to obtain ultralow thermal conductivity for optimizing thermoelectric properties of polycrystalline SnSe.169
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Yaru Gong, Cheng Chang, Wei Wei, Jiang Liu, Wenjie Xiong, Shuang Chai, Di Li, Jian Zhang, Guodong Tang,