| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7913608 | Scripta Materialia | 2014 | 4 Pages |
Abstract
The mechanism of grain refinement in Cu-doped Ni-Ti thin films has been investigated by transmission electron microscopy. Sputter-deposited (Ni,Cu)-rich Ni-Ti-Cu thin films exhibited a columnar structure consisting of grains whose lateral size decreased with increasing Cu content. Cu-rich grain boundary segregation was found to become prominent in films containing higher Cu contents. This segregation was attributed to a non-polymorphic crystallization process which lowered the grain growth rate as the Cu content in the films increased.
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Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
M. Callisti, B.G. Mellor, T. Polcar,