Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7919279 | Energy Procedia | 2017 | 9 Pages |
Abstract
This paper presents first results of combining two promising future technologies: i) metal catalyzed textured diamond-wire sawn (DWS) mc-Si wafers and ii) nickel-copper-silver (Ni/CuAg) plated front contact processing. Results of first optimizations of laser patterning, annealing and module string soldering are presented. A 60-cell module with a power output of 266 W was successfully manufactured. The pseudo fill-factor (pFF) has been identified as the parameter with the highest potential for further improvements. A very promising approach is moving from an emitter profile that is mainly adapted to silver paste properties to an optimized emitter profile for Ni/Cu/Ag-plated contacts. The idea is to reduce the surface doping concentration (reduces Auger recombination) and increase the junction depth (increased pFF and FF).
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Physical Sciences and Engineering
Energy
Energy (General)
Authors
D. Pysch, N. Bay, J. Burschik, W. Dümpelfeld, H. Kühnlein, B. Lee, A. Letize, M. Passig, X. Qu, M. Sieber, K. Vosteen,