Article ID Journal Published Year Pages File Type
7919279 Energy Procedia 2017 9 Pages PDF
Abstract
This paper presents first results of combining two promising future technologies: i) metal catalyzed textured diamond-wire sawn (DWS) mc-Si wafers and ii) nickel-copper-silver (Ni/CuAg) plated front contact processing. Results of first optimizations of laser patterning, annealing and module string soldering are presented. A 60-cell module with a power output of 266 W was successfully manufactured. The pseudo fill-factor (pFF) has been identified as the parameter with the highest potential for further improvements. A very promising approach is moving from an emitter profile that is mainly adapted to silver paste properties to an optimized emitter profile for Ni/Cu/Ag-plated contacts. The idea is to reduce the surface doping concentration (reduces Auger recombination) and increase the junction depth (increased pFF and FF).
Related Topics
Physical Sciences and Engineering Energy Energy (General)
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