| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7923598 | Materials Chemistry and Physics | 2011 | 6 Pages |
Abstract
⺠The evolution of percolation threshold in electroless deposited Ag and Cu thin films was studied and ELD as a method for controllable percolation was analyzed. ⺠It was observed that Ag and Cu thin films reach percolation threshold at the thicknesses of 35 nm and 30 nm, respectively. ⺠It has been shown that the film resistivity varies according to power law. The critical exponents of 0.95 and 1.04 for Ag and Cu, respectively, were extracted.
Related Topics
Physical Sciences and Engineering
Materials Science
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Authors
V. Sabayev, N. Croitoru, A. Inberg, Y. Shacham-Diamand,