Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7924425 | Modern Electronic Materials | 2017 | 5 Pages |
Abstract
We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6Â K/W thermal resistance for a 24Â mm2 chip area.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
Vasily S. Anosov, Denis V. Gomzikov, Maxim I. Ichetovkin, Lev A. Seidman, Roman I. Tychkin,